OCP-IP Hosts Conference Within a Conference at DATE
PORTLAND, Ore.—(BUSINESS WIRE)—March 1, 2005—
The Open Core Protocol International Partnership
(OCP-IP) will feature a conference-within-conference program at the
Design Automation and Test Expo (DATE) held 7-11 March 2005 in Munich,
Germany. The Pavilion will host exhibits from several OCP-IP member
companies including Sonics, CAST, and MIPS and an open discussion
forum in the midst of Europe's largest electronic system design
exhibition. The pavilion program will combine expert panel sessions
and papers, offering visitors a view into key technical trends and
insight into the SoC market of the future.
Papers and panels will encompass the diverse issues surrounding
re-usable IP, such as: IP development, purchasing, interconnect,
verification and testing, IP quality, network on chip (NoC) and more.
Presentations will be given by many OCP-IP member companies
including: Accent, CoWare, First Silicon Solutions, MIPS, Nokia,
Prosilog, Texas Instruments, TransEDA, Yogitech, and more. Panels will
include: "Network on a Chip: Great idea, but where are the
implementations?" "IP from silicon vendors: Good or bad?" "New
Paradigm for Design Excellence: What's on the Horizon?" moderated by
Gary Smith, and "What is EDA Missing?" hosted by Ulf Schlictmann,
University of Munich.
For more information on the OCP-IP DATE Pavilion see
www.ocpip.org.
About OCP-IP
The OCP International Partnership Association, Inc. (OCP-IP),
formed in 2001, promotes and supports the Open Core Protocol (OCP) as
the complete socket standard ensuring rapid creation and integration
of interoperable virtual components. OCP-IP's Governing Steering
Committee participants are: Nokia (NYSE:NOK), Texas Instruments
(NYSE:TXN), STMicroelectronics (NYSE:STM), Toshiba Semiconductor Group
(including Toshiba America TAEC), and Sonics. OCP-IP is a non-profit
corporation delivering the first fully supported, openly licensed,
core-centric protocol comprehensively fulfilling system-level
integration requirements. The OCP facilitates IP core reusability and
reduces design time, risk, and manufacturing costs for SoC designs.
VSIA endorses the OCP socket, and OCP-IP is affiliated with the VSI
Alliance. For additional background and membership information, visit
www.OCPIP.org.
NOTE: All trademarks and service marks are the property of their
respective owners.
Contact:
OCP-IP
Ian Mackintosh, 650-938-2500 ext. 106
ian@ocpip.org
or
VitalCom
Joe Basques, 650-366-8212 ext. 202
joe@vitalcompr.com
